Instruction:
Dr. Tal Goldrath, Nicky Strumtza (Intel)

This project was conducted at Intel’s development center in Haifa, in a laboratory where Intel processors undergo validation tests at temperatures ranging from -40ºC to 150ºC.

Tests carried out at temperatures below the dew point risk wetness and ice forming on components around the processor. In an edge-case test carried out at -40ºC designed to test the effects of thin-layer shrinkage on the processor’s function, this phenomenon ruins the testing equipment, causing financial damage to the company.

In this project, we created a mechanical-thermodynamic solution for this problem, enabling the company to safely carry out 24-hour -40ºC tests with no risk of wetness or ice formation.

We mechanically designed three systems that could solve the problem. We ran laboratory tests and computer simulations to learn how different parameters affected each system’s performance and draw conclusions about its effectiveness. We analyzed the results, optimized the system accordingly, and reiterated until we reached a ready-to-use system that met Intel’s requirements.